HSE06-503045
CUI Devices
Product No:
HSE06-503045
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Quantity:
In Stock : 1101
Minimum: 1 Multiples: 1
Qty
Unit Price
1
2.2325
10
2.15745
25
2.0957
50
1.97087
100
1.771275
250
1.74629
500
1.634038
1000
1.609082
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Board Level |
| Shape | Rectangular, Fins |
| Width | 1.181" (30.00mm) |
| Length | 1.969" (50.00mm) |
| Series | HSE |
| Package | Bag |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 1.772" (45.00mm) |
| Package Cooled | TO-218, TO-220 |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Clip |
| Thermal Resistance @ Natural | 5.86°C/W |
| Power Dissipation @ Temperature Rise | 12.79W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 2.10°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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