HSB20-353525
CUI Devices
Product No:
HSB20-353525
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 35 X 35 X 25 MM
Quantity:
In Stock : 478
Minimum: 1 Multiples: 1
Qty
Unit Price
1
1.881
10
1.8316
25
1.7822
50
1.6834
100
1.584315
250
1.485306
500
1.435792
1000
1.287269
5000
1.262512
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.378" (35.00mm) |
| Length | 1.378" (35.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.984" (25.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 6.65°C/W |
| Power Dissipation @ Temperature Rise | 11.3W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 2.70°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
