HSB15-404010
CUI Devices
Product No:
HSB15-404010
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 40 X 40 X 10 MM
Quantity:
In Stock : 1020
Minimum: 1 Multiples: 1
Qty
Unit Price
1
1.501
10
1.4288
25
1.39156
50
1.35413
100
1.278795
250
1.203612
500
1.128372
1000
1.053151
5000
1.015531
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.575" (40.00mm) |
| Length | 1.575" (40.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.394" (10.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 11.84°C/W |
| Power Dissipation @ Temperature Rise | 6.3W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 3.90°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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