HSB05-171711
CUI Devices
Product No:
HSB05-171711
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 17 X 17 X 11.5 M
Quantity:
In Stock : 2573
Minimum: 1 Multiples: 1
Qty
Unit Price
1
1.026
10
0.97565
25
0.94962
50
0.92397
100
0.87267
250
0.821332
500
0.769994
1000
0.718666
5000
0.692996
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.669" (17.00mm) |
| Length | 0.669" (17.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.453" (11.50mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 23.91°C/W |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 8.40°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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