HSB03-121218
CUI Devices
Product No:
HSB03-121218
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 12 X 12 X 18 MM
Quantity:
In Stock : 2268
Minimum: 1 Multiples: 1
Qty
Unit Price
1
0.8645
10
0.81985
25
0.77862
40
0.757862
80
0.747774
230
0.696512
440
0.655519
2520
0.594073
5040
0.573591
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.472" (12.00mm) |
| Length | 0.472" (12.00mm) |
| Series | HSB |
| Package | Tray |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.709" (18.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 24.01°C/W |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
