FI-E30S
JAE Electronics
Product No:
FI-E30S
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
CONN RCPT 30P 0.039 GOLD SMD R/A
Quantity:
In Stock : 24
Minimum: 1 Multiples: 1
Qty
Unit Price
1
8.721
10
7.8451
80
7.011598
440
5.874544
945
5.192339
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Product Information
Parameter Info
User Guide
| Mfr | JAE Electronics |
| Style | Board to Cable/Wire |
| Series | FI-E |
| Package | Tray |
| Features | Ground Plate, Solder Retention |
| Termination | Solder |
| Applications | General Purpose |
| Contact Type | Non-Gendered |
| Contact Shape | - |
| Mounting Type | Surface Mount, Right Angle |
| Connector Type | Receptacle |
| Fastening Type | Latch Holder |
| Number of Rows | 1 |
| Pitch - Mating | 0.039" (1.00mm) |
| Product Status | Active |
| Voltage Rating | 200V |
| Contact Material | Copper Alloy |
| Insulation Color | - |
| Insulation Height | 0.126" (3.20mm) |
| Ingress Protection | - |
| Base Product Number | FI-E30 |
| Insulation Material | Plastic |
| Number of Positions | 30 |
| Row Spacing - Mating | - |
| Contact Finish - Post | Tin |
| Contact Length - Post | - |
| Current Rating (Amps) | 1A per Contact |
| Operating Temperature | -40°C ~ 80°C |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | - |
| Contact Finish Thickness - Mating | - |
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