Omron Electronics Inc-EMC Div
型号:
XG8B-0134
封装:
-
批次:
-
描述:
CONN HEADER R/A 100P 2.54MM
购买数量:
最小起订量: 1 最小递增量: 1
数量
单价
1
14.725
10
13.05015
100
11.37701
500
9.703946
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Mfr | Omron Electronics Inc-EMC Div |
Style | Board to Board or Cable |
Series | XG8 |
Package | Bulk |
Features | - |
Shrouding | Unshrouded |
Termination | Solder |
Applications | - |
Contact Type | Male Pin |
Contact Shape | Square |
Mounting Type | Through Hole, Right Angle |
Connector Type | Header |
Fastening Type | Push-Pull |
Number of Rows | 2 |
Pitch - Mating | 0.100" (2.54mm) |
Product Status | Active |
Voltage Rating | 300V |
Contact Material | Brass, Nickel |
Insulation Color | Black |
Insulation Height | 0.244" (6.20mm) |
Ingress Protection | - |
Base Product Number | XG8B |
Insulation Material | Polybutylene Terephthalate (PBT), Glass Filled |
Number of Positions | 100 |
Row Spacing - Mating | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Length - Post | 0.110" (2.79mm) |
Current Rating (Amps) | 3A |
Operating Temperature | -55°C ~ 105°C |
Mated Stacking Heights | - |
Overall Contact Length | - |
Contact Finish - Mating | Gold |
Contact Length - Mating | 0.236" (6.00mm) |
Number of Positions Loaded | All |
Material Flammability Rating | UL94 V-0 |
Contact Finish Thickness - Post | 78.7µin (2.00µm) |
Contact Finish Thickness - Mating | 5.90µin (0.150µm) |