XG8B-0134

Omron Electronics Inc-EMC Div

型号:

XG8B-0134

封装:

-

批次:

-

数据手册:

描述:

CONN HEADER R/A 100P 2.54MM

购买数量:

库存 : 82

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    14.725

  • 10

    13.05015

  • 100

    11.37701

  • 500

    9.703946

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产品信息

参数信息
用户指南
Mfr Omron Electronics Inc-EMC Div
Style Board to Board or Cable
Series XG8
Package Bulk
Features -
Shrouding Unshrouded
Termination Solder
Applications -
Contact Type Male Pin
Contact Shape Square
Mounting Type Through Hole, Right Angle
Connector Type Header
Fastening Type Push-Pull
Number of Rows 2
Pitch - Mating 0.100" (2.54mm)
Product Status Active
Voltage Rating 300V
Contact Material Brass, Nickel
Insulation Color Black
Insulation Height 0.244" (6.20mm)
Ingress Protection -
Base Product Number XG8B
Insulation Material Polybutylene Terephthalate (PBT), Glass Filled
Number of Positions 100
Row Spacing - Mating 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Length - Post 0.110" (2.79mm)
Current Rating (Amps) 3A
Operating Temperature -55°C ~ 105°C
Mated Stacking Heights -
Overall Contact Length -
Contact Finish - Mating Gold
Contact Length - Mating 0.236" (6.00mm)
Number of Positions Loaded All
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post 78.7µin (2.00µm)
Contact Finish Thickness - Mating 5.90µin (0.150µm)