SP1-50X50-G

BusBoard Prototype Systems

型号:

SP1-50X50-G

封装:

-

批次:

-

数据手册:

描述:

SMTPADS-1 50X50MIL PADS, TOP-SID

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr BusBoard Prototype Systems
Pitch -
Series -
Package Bag
Plating Non-Plated Through Hole (NPTH)
Material FR4 Epoxy Glass
Edge Contacts -
Hole Diameter -
Product Status Active
Board Thickness 0.063" (1.60mm)
Circuit Pattern Pad Per Hole (Square)
Proto Board Type Breadboard, General Purpose
Size / Dimension 3.15" L x 1.97" W (80.0mm x 50.0mm)