Chip Quik Inc.
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| Mfr | Chip Quik Inc. |
| Form | Jar, 8.8 oz (250g) |
| Type | Solder Paste |
| Series | CHIPQUIK® |
| Weight | - |
| Package | Bulk |
| Process | - |
| Diameter | - |
| Flux Type | No-Clean |
| Shelf Life | 6 Months |
| Wire Gauge | - |
| Composition | Sn42Bi57.6Ag0.4 (42/57.6/0.4) |
| Melting Point | 280°F (138°C) |
| Shipping Info | - |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | - |