Chip Quik Inc.
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Mfr | Chip Quik Inc. |
Form | Spool, 1 lb (454 g) |
Type | Wire Solder |
Series | - |
Package | Bulk |
Process | Lead Free |
Diameter | 0.031" (0.79mm) |
Flux Type | No-Clean |
Shelf Life | - |
Wire Gauge | 20 AWG, 21 SWG |
Composition | Sn99.3Cu0.7 (99.3/0.7) |
Melting Point | 441°F (227°C) |
Product Status | Active |
Shelf Life Start | - |
Base Product Number | NC2SW |
Storage/Refrigeration Temperature | - |