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HSS28-B20-P39

CUI Devices

型号:

HSS28-B20-P39

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, STAMPING, TO-218/TO-2

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Board Level
Shape Square, Fins
Width 0.748" (19.00mm)
Length 0.748" (19.00mm)
Series HSS
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 0.374" (9.50mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Thermal Resistance @ Natural 27.66°C/W
Power Dissipation @ Temperature Rise 2.71W @ 75°C
Thermal Resistance @ Forced Air Flow 12.00°C/W @ 200 LFM