首页 / 散热器 / HSB27-434316

HSB27-434316

CUI Devices

型号:

HSB27-434316

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 43.1 X 43.1 X 16

购买数量:

库存 : 996

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    2.47

  • 10

    2.3902

  • 25

    2.32104

  • 50

    2.1831

  • 100

    1.96194

  • 250

    1.934352

  • 500

    1.809997

  • 1000

    1.782371

请发送询价,我们将立即回复。

Certif02 Certif07 Certif03

产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.697" (43.10mm)
Length 1.697" (43.10mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.650" (16.51mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 8.35°C/W
Power Dissipation @ Temperature Rise 8.98W @ 75°C
Thermal Resistance @ Forced Air Flow 2.80°C/W @ 200 LFM