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HSB24-252510

CUI Devices

型号:

HSB24-252510

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA,25 X 25 X 10 MM

购买数量:

库存 : 737

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    0.7695

  • 10

    0.7467

  • 25

    0.72542

  • 50

    0.68229

  • 100

    0.61313

  • 250

    0.604504

  • 500

    0.56563

  • 1000

    0.556985

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.984" (25.00mm)
Length 0.984" (25.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.394" (10.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 18.10°C/W
Power Dissipation @ Temperature Rise 4.14W @ 75°C
Thermal Resistance @ Forced Air Flow 6.50°C/W @ 200 LFM