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HSB19-272718

CUI Devices

型号:

HSB19-272718

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 27 X 27 X 18 MM

购买数量:

库存 : 631

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.8335

  • 10

    1.73755

  • 25

    1.69176

  • 50

    1.64597

  • 100

    1.554485

  • 250

    1.463038

  • 500

    1.37161

  • 1000

    1.280163

  • 5000

    1.234449

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.063" (27.00mm)
Length 1.063" (27.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.709" (18.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 11.11°C/W
Power Dissipation @ Temperature Rise 6.8W @ 75°C
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM