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HSB11-252518

CUI Devices

型号:

HSB11-252518

品牌:

CUI Devices

封装:

-

批次:

-

数据手册:

描述:

HEAT SINK, BGA, 25 X 25 X 18 MM

购买数量:

库存 : 54

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    1.216

  • 10

    1.15235

  • 25

    1.12176

  • 50

    1.09155

  • 100

    1.030845

  • 250

    0.970254

  • 500

    0.909606

  • 1000

    0.848968

  • 5000

    0.818644

请发送询价,我们将立即回复。

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产品信息

参数信息
用户指南
Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 0.984" (25.00mm)
Length 0.984" (25.00mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.709" (18.00mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 13.70°C/W
Power Dissipation @ Temperature Rise 5.5W @ 75°C
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 200 LFM