CUI Devices
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| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.827" (21.00mm) |
| Length | 0.827" (21.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.591" (15.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 17.39°C/W |
| Power Dissipation @ Temperature Rise | 4.3W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 200 LFM |