FI-XB30SSRLA-HF16

JAE Electronics

型号:

FI-XB30SSRLA-HF16

封装:

-

批次:

-

数据手册:

-

描述:

CONN RCPT 30P 0.039 GOLD SMD R/A

购买数量:

库存 : 3267

最小起订量: 1 最小递增量: 1

数量

单价

  • 1

    16.8435

  • 10

    14.59865

  • 100

    12.03213

  • 500

    10.989353

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产品信息

参数信息
用户指南
Mfr JAE Electronics
Style Board to Cable/Wire
Series FI-X
Package Strip
Features Grounding Pins, Shielded, Solder Retention
Termination Solder
Applications General Purpose
Contact Type Non-Gendered
Contact Shape -
Mounting Type Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Connector Type Receptacle
Fastening Type Friction Lock
Number of Rows 1
Pitch - Mating 0.039" (1.00mm)
Product Status Active
Voltage Rating 200V
Contact Material Copper Alloy
Insulation Color Black
Insulation Height -
Ingress Protection -
Base Product Number FI-XB30
Insulation Material Plastic
Number of Positions 30
Row Spacing - Mating -
Contact Finish - Post Tin
Contact Length - Post -
Current Rating (Amps) 1A per Contact
Operating Temperature -40°C ~ 80°C
Mated Stacking Heights -
Contact Finish - Mating Gold
Number of Positions Loaded All
Material Flammability Rating UL94 V-0
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 3.90µin (0.099µm)