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FF6MR12W2M1HPB11BPSA1

Infineon Technologies

型号:

FF6MR12W2M1HPB11BPSA1

封装:

Module

批次:

-

数据手册:

-

描述:

LOW POWER EASY

购买数量:

库存 : 请查询

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产品信息

参数信息
用户指南
Mfr Infineon Technologies
Series HEXFET®
Package Tray
Technology Silicon Carbide (SiC)
FET Feature Silicon Carbide (SiC)
Power - Max -
Configuration 2 N-Channel
Mounting Type Chassis Mount
Package / Case Module
Product Status Active
Vgs(th) (Max) @ Id 5.55V @ 80mA
Operating Temperature -40°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs 5.63mOhm @ 200A, 15V
Supplier Device Package Module
Gate Charge (Qg) (Max) @ Vgs 496nC @ 15V
Drain to Source Voltage (Vdss) 1200V
Input Capacitance (Ciss) (Max) @ Vds 14700pF @ 800V
Current - Continuous Drain (Id) @ 25°C 200A (Tj)