Laird Technologies EMI
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Mfr | Laird Technologies EMI |
Type | Gap Filler Pad, Sheet |
Color | Green |
Shape | Square |
Usage | - |
Series | Tflex™ 300 |
Outline | 457.20mm x 457.20mm |
Package | Bulk |
Adhesive | - |
Material | Silicone, Ceramic Filled |
Thickness | 0.200" (5.08mm) |
Shelf Life | 24 Months |
Product Status | Active |
Backing, Carrier | - |
Digi-Key Storage | - |
Shelf Life Start | Date of Shipment |
Thermal Resistivity | - |
Thermal Conductivity | 1.2W/m-K |
Storage/Refrigeration Temperature | - |