44764-0403
Molex
库存 : 1175
最小起订量: 1 最小递增量: 1
数量
单价
30
2.4795
150
2.3845
600
2.337
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产品信息
参数信息
用户指南
| Mfr | Molex |
| Style | Board to Board or Cable |
| Series | Micro-Fit 3.0 BMI 44764 |
| Package | Box |
| Features | Blind Mating, Board Guide |
| Termination | Solder |
| Applications | General Purpose, Telecommunications |
| Contact Type | Female Socket |
| Contact Shape | Square |
| Mounting Type | Through Hole, Right Angle |
| Connector Type | Receptacle |
| Fastening Type | Push-Pull |
| Number of Rows | 2 |
| Pitch - Mating | 0.118" (3.00mm) |
| Product Status | Active |
| Voltage Rating | 600VAC/DC |
| Contact Material | Phosphor Bronze Alloy |
| Insulation Color | Black |
| Insulation Height | 0.410" (10.41mm) |
| Ingress Protection | - |
| Insulation Material | Liquid Crystal Polymer (LCP), Glass Filled |
| Number of Positions | 4 |
| Row Spacing - Mating | 0.118" (3.00mm) |
| Contact Finish - Post | Tin |
| Contact Length - Post | 0.155" (3.94mm) |
| Current Rating (Amps) | Varies by Wire Gauge |
| Operating Temperature | -40°C ~ 105°C |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) |
| Contact Finish Thickness - Mating | 3.00µin (0.076µm) |
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